Rework and underfill nozzle for electronic components

ABSTRACT

A method and apparatus for desoldering electronic components from a substrate. A vacuum is used, to enhance the flow of a hot gas under an electronic component to reflow the solder connections attaching the electronic component to a substrate. Water vapor is added to the hot gas to increase the heat capacity of the hot gas. A system for periodically changing the direction of flow of the hot gas and vacuum under the electronic component is used to uniformly heat the solder connections. 
     A method and apparatus for depositing underfill material between an electronic component and the substrate on which the electronic component is mounted. A vacuum is applied to enhance the flow of underfill material into the space between the electronic component and the substrate.

This application is a continuation of Ser. No. 09/244,565, filed on Feb.2, 1999 now U.S. Pat. No. 6,220,503.

FIELD OF THE INVENTION

The present invention is in the field of integrated circuits. Moreparticularly, the present invention provides a method and apparatus fordesoldering electronic components from a substrate. Another embodimentof the present invention provides a method and apparatus for depositingunderfill material between an electronic component and the substrate onwhich the electronic component is mounted.

BACKGROUND OF THE INVENTION

Electronic components, such as integrated circuit chips, are commonlyattached to a substrate (e.g., a printed circuit board (PCB) or printedcircuit card (PCC)) with solder connections using a ball grid array(BGA), chip scale package (CSP), or direct chip attach (DCA) technique.Occasionally, an electronic component may be found to be defective, andwill therefore have to be removed and replaced with a functionalelectronic component using a rework process. In a conventional reworkprocess, the defective electronic component is removed by first heatingthe solder material, used to connect the component's solder connectorsto corresponding contact pads on the substrate, to its melting, or“reflow” temperature. Then, the defective electronic component is pulledoff the substrate and replaced.

In a conventional rework process, a stream of hot gas is typicallydirected toward the top of the electronic component. This method workswell if the solder connections are only located around or near theperiphery of the electronic component, or when there is a relativelylarge gap between the bottom of the electronic component and thesubstrate. Unfortunately, using currently available reflow methods, heatfrom the stream of hot gas is not effectively or evenly transmitted tosolder connections located away from the periphery of the electroniccomponent (e.g., near the center of the electronic component). This isespecially problematic if the space between the electronic component andthe substrate is small, thereby restricting the flow of hot gas from theperiphery to the center of the electronic component.

Electronic components mounted on a substrate commonly require underfillto increase reliability, mechanical integrity, and to ensure adequateoperational life. For example, an underfill material such as epoxy iscommonly inserted between an electronic component and a substrate tocover the solder connections, thereby protecting the solder connectionsfrom corrosion causing fluids or gases, and mechanically strengtheningthe connection between the electronic component and the substrate.Further, the use of underfill reduces failure of the solder connectionsdue to cycling stresses caused by differences in the coefficients ofthermal expansion of the electronic component and the substrate. Thus,underfill provides a robust mechanical connection preventing damagingrelative motion between the electronic component and the substrate.

Commonly, the underfilling is accomplished by depositing a bead ofunderfill material along one or more sides of the electronic componentand allowing capillary action to pull the underfill material under theelectronic component. Unfortunately, not only is the process relativelyslow and may leave voids in the underfill, but also requires theunderfill material to be very fluid in nature. Thus, restrictions areplaced on the composition of the underfill material.

SUMMARY OF THE INVENTION

The present invention avoids the disadvantages of the prior art byproviding an improved method and apparatus for removing an electroniccomponent from a substrate. Also, it the current invention provides animproved method and apparatus for applying underfill between theelectronic component and the substrate.

In accordance with the present invention, a rework nozzle apparatus isused to remove an electronic component from a substrate. The reworknozzle apparatus includes an outer tube, an inner shaft, baffles, avacuum source, a hot gas source, and a water vapor port. The outer tubehas a cross-sectional shape slightly larger than that of the electroniccomponent. A first end of the outer tube contacts the substrate surface,encloses the electronic component, and provides an essentially gas tightseal. The inner shaft has a cross-sectional shape similar to the topsurface of the electronic component. A first end of the inner shaftcontacts, and essentially provides a gas tight seal against, the topsurface of the electronic component. The first end of the inner shaftmay include projections for locating the electronic component in thehorizontal direction. Baffles are attached between the inner shaft andthe outer tube to direct a flow of hot gas beneath the electroniccomponent, and to provide a seal against the substrate adjacent twosides of the electronic component. The outer tube, inner shaft, and thebaffles form two ducts. The first duct is used to carry and direct astream of hot gas to a region under a first side of the electroniccomponent. The second duct is used to apply a vacuum to a region under asecond side of the electronic component to increase the flow of hot gasunder the electronic component. The vacuum is provided to the secondduct by a vacuum source such as a vacuum pump. Solder connections underthe electronic component are heated to a reflow temperature allowing theelectronic component to be removed from the substrate. In order toincrease the heat capacity of the hot gas, thereby enhancing thermaltransfer to the solder connections, water vapor, or other suitablesubstance, is added to the hot gas through a water vapor port.

The rework nozzle apparatus may additionally include a verticalpositioning apparatus, a heating element, and a reversing valve. Thevertical positioning apparatus provides vertical positioning relative tothe inner shaft, by means of a drive system such as a linear motor orstepper motor. The vertical positioning apparatus is slidably attachedto the inner shaft. Heat is applied by the heating element to the innershaft, preventing the inner shaft from drawing heat away from theelectronic component during the rework process. The reversing valveperiodically switches the vacuum from the second duct to the first duct,and simultaneously switches the hot gas from the first duct to thesecond duct, effectively reversing the direction of flow of the streamof hot gas. At the same time, the water vapor is switched from a watervapor port on the first duct to a water vapor port on the second duct.Advantageously, the use of the reversing valve provides a more uniformheating of the solder connections.

In accordance with the present invention, an underfill nozzle apparatusis used to insert underfill material under the electronic component.Preferably, underfill material is deposited along three sides of theelectronic component, and a vacuum is applied under the fourth side ofthe electronic component to draw the underfill material under theelectronic component.

The underfill nozzle apparatus includes a vacuum tube and a vacuumsource. A first end of the vacuum tube contacts the substrate surfaceand provides an essentially gas tight seal. A side of the vacuum tubecontacting the electronic component has an opening sized according tothe cross-sectional open area under the electronic component. A vacuumis drawn through this opening promoting the flow of the underfillmaterial under the electronic component.

Another embodiment of the underfill nozzle apparatus includes a vacuumtube, a vacuum source, an underfill tube, an underfill material source,baffles, a heat generating apparatus, and a control system. A first sideof the vacuum tube contacts a first side of the electronic component. Afirst side of the underfill tube contacts a second, opposing side of theelectronic component. The first side of the vacuum tube and the firstside of the underfill tube each include an opening sized according tothe cross-sectional open area under the electronic component.

The vacuum tube includes a first end that contacts the substratesurface, and a second end that is connected to a vacuum source. Theunderfill tube includes a first end that contacts the substrate surface,and a second end that is connected to a source of underfill material. Aseries of baffles are used to couple the vacuum tube to the underfilltube, and to seal the openings under the remaining open sides of theelectronic component.

The heat generating apparatus provides means for heating the electroniccomponent and the underfill material in the underfill tube to reduce theeffective viscosity of the underfill material. The reduced viscosity ofthe underfill material results in a faster flow rate of underfillmaterial beneath the electronic component.

Another embodiment of an underfill nozzle apparatus in accordance withthe present invention includes a vacuum tube. A through hole is providedin the substrate at a location under the electronic component. Underfillmaterial is deposited along the periphery of the electronic componentand a first end of the vacuum tube is placed over the substrate throughhole. The first end of the vacuum tube contacts the substrate surface onthe side opposite from the electronic component, forming an essentiallygas tight seal. A vacuum source is connected to a second end of thevacuum tube to generate a vacuum in the vacuum tube, the substrate hole,and the space underneath the electronic component. This vacuum rapidlypulls the underfill material under the electronic component.

In another embodiment of the underfill nozzle apparatus, a vacuum tubesurrounds the electronic component on a first side of the substrate. Athrough hole is provided in the substrate at a location under theelectronic component. A first end of an underfill tube contacts thesubstrate surface on the side opposite the electronic component, andencloses the through hole. A second end of the underfill tube isconnected to an underfill supply source that provides underfill materialto the area under the electronic component via the underfill tube andthrough hole. The vacuum surrounding the electronic component causes theunderfill to rapidly fill the space under the electronic component.

BRIEF DESCRIPTION OF THE DRAWINGS

The features of the present invention will best be understood from adetailed description of the invention and a preferred embodiment thereofselected for the purposes of illustration and shown in the accompanyingdrawings in which:

FIG. 1 illustrates a plan cross-sectional view of a rework nozzleapparatus in accordance with a first embodiment of the presentinvention;

FIG. 2 illustrates a cross-sectional view taken along line 2—2 of therework nozzle apparatus of FIG. 1;

FIG. 3 illustrates a cross-sectional view taken along line 3—3 of therework nozzle apparatus of FIG. 1;

FIG. 4 illustrates a plan cross-sectional view of a rework nozzleapparatus in accordance with a second embodiment of the presentinvention;

FIG. 5 illustrates a cross-sectional view taken along line 5—5 of therework nozzle apparatus of FIG. 4;

FIG. 6 illustrates a cross-sectional view taken along line 6—6 of therework nozzle apparatus of FIG. 4;

FIG. 7 illustrates a plan cross-sectional view of a first embodiment ofan underfill nozzle apparatus in accordance with the present invention;

FIG. 8 illustrates a cross-sectional view taken along line 7—7 of theunderfill nozzle apparatus of FIG. 7;

FIG. 9 illustrates a plan cross-sectional view of a second embodiment ofan underfill nozzle apparatus in accordance with the present invention;

FIG. 10 illustrates a cross-sectional view taken along line 9—9 of theunderfill nozzle apparatus of FIG. 9;

FIG. 11 illustrates a plan view of another embodiment of an underfillnozzle apparatus in accordance with the present invention;

FIG. 12 illustrates a cross-sectional view taken along line 12—12 of theunderfill nozzle apparatus of FIG. 11;

FIG. 13 illustrates a plan cross-sectional view of another embodiment ofan underfill nozzle apparatus in accordance with the present invention;and

FIG. 14 illustrates a cross-sectional view taken along line 14—14 of theunderfill nozzle apparatus of FIG. 13.

DETAILED DESCRIPTION OF THE INVENTION

The features and advantages of the present invention are illustrated indetail in the accompanying drawings, wherein like reference numeralsrefer to like elements throughout the drawings.

A rework nozzle apparatus 10 in accordance with a first embodiment ofthe present invention is illustrated in FIGS. 1, 2 and 3. The reworknozzle apparatus 10 is used to remove an electronic component 26 from asubstrate 30 by heating the solder connections 46 that attach theelectronic component 26 to the substrate 30 to a suitable reflowtemperature. The rework nozzle apparatus 10 includes an outer tube 12,an inner shaft 14, baffles 16, 18, a vacuum source 20, a hot gas source22, and a water vapor port 24. The outer tube 12 has a cross-sectionalshape slightly larger than that of the electronic component 26. A firstend 28 of the outer tube 12 contacts the surface of the substrate 30,and provides an essentially gas tight seal around the electroniccomponent 26. The first end 28 of the outer tube 12 can also includecurving bottom walls 29 as shown by the phantom lines in FIG. 2. Thecurving bottom walls 29 assist the flow of gas or liquid under theelectronic component 26. Although described in conjunction with theembodiment illustrated in FIG. 2, it should be clear that the curvingbottom walls 29 can also be used in the additional embodiments of thepresent invention described below. The inner shaft 14 has across-sectional shape similar to the top surface 32 of the electroniccomponent 26. A first end 34 of the inner shaft 14 contacts and providesa gas tight seal against the top surface 32 of the electronic component26.

The inner shaft 14 is attached to the outer tube 12 by the baffles 16,18. The baffles 16, 18 also provide a seal against the surface of thesubstrate 30 on opposing sides 36, 39 of the electronic component 26.The outer tube 12, the inner shaft 14, and the baffles 16, 18, form twoducts 38, 40 as shown in FIGS. 1 and 2. Duct 38 is used to carry anddirect a supply of hot gas from the hot gas source 22 to the space 42under the electronic component 26. Also, to increase the heat capacityof the hot gas, water vapor 44 is added through a water vapor port 24.Duct 40 is used to apply a vacuum generated by the vacuum source 20 tothe space 42 under the electronic component. The use of the vacuumincreases the flow of hot gas 22 passing over the solder connections 46,thereby decreasing the time required to heat the solder connections 46to a required reflow temperature. After the solder connections 46 areheated to the reflow temperature, the electronic component 26 can beremoved from the substrate 30.

A second embodiment of a rework nozzle apparatus 13 in accordance withthe present invention is illustrated in FIGS. 4, 5 and 6. The reworknozzle apparatus 13 includes an outer tube 52, an inner shaft 54, avertical positioning apparatus 72, a heating element 70, baffles 56, 58,a vacuum source 20, a hot gas source 22, a water vapor source 44, watervapor ports 24, 25, and a reversing valve 80.

The outer tube 52 has a cross-sectional shape slightly larger than thatof the electronic component 26. A first end 41 of the outer tube 52contacts the surface of the substrate 30, and provides an essentiallygas tight seal around the electronic component 26. The inner shaft 54has a cross-sectional shape similar to the top surface 32 of theelectronic component 26, and has projections 74 for locating theelectronic component 26 in the horizontal direction.

As illustrated in FIGS. 4 and 6, the baffles 56, 58 are attached to theinner shaft 54 and the outer tube 52. As further illustrated in FIG. 6,the baffles 56, 58 extend to the surface of the substrate 30, therebyproviding a seal against the surface of the substrate 30 on opposingsides 36, 39 of the electronic component 26. The outer tube 52, theinner shaft 54, and the baffles 56, 58 form two ducts 82 and 84 asillustrated in FIGS. 4 and 5.

The vertical positioning apparatus 72 is slidably attached 76 to theinner shaft 54. A vacuum is applied to a vacuum port 78 to hold the topsurface 32 of the electronic component 26 against the verticalpositioning apparatus 72. The vertical positioning apparatus 72 providesvertical positioning of the electronic component 26 relative to thesubstrate 30. The vertical positioning apparatus 72 preferably includesa linear motor or stepper motor (not shown) or other suitable drivesystem.

The heating element 70 preheats the inner shaft 54 to prevent heat frombeing drawn away from the electronic component 32 during the reworkprocess. The inner shaft 54 may be preheated using a resistive heatingelement, a source of hot gas, or other suitable heating system.

As in the first embodiment of the rework nozzle apparatus 10, a streamof hot gas, a vacuum, and a supply of water vapor are used to facilitateand accelerate the rework process. In the second embodiment of therework nozzle 13, however, a reversing valve 80 is additionally used toprovide a more uniform heating of the solder connections 46 of theelectronic component 26.

As illustrated in FIG. 5, the hot gas supply 22 and the water vaporsupply 44 are provided to the reversing valve 80. In addition, thevacuum source 20 is coupled to the reversing valve 80. A first set ofconduits 92, 94 are provided to selectively direct a stream of hot gasor a vacuum from the reversing valve 80 to the ducts 82, 84 throughports 86, 88, respectively. A second set of conduits 90, 96 are providedto selectively direct water vapor from the reversing valve 80 to thewater vapor ports 24, 25 located in ducts 82, 84, respectively.

A first operating position of the reversing valve 80 causes the vacuumsource 20 to generate a vacuum in duct 84 via conduit 92 and port 88,and simultaneously causes a stream of hot gas provided by the hot gassource 22 to be supplied through conduit 94 and port 86 to the duct 82.Thus, hot air passes in a first direction through duct 82, under theelectronic component 26, and into duct 84. The hot air is subsequentlydrawn out of duct 84 through port 88 and conduit 92. In addition, thefirst operating position of the reversing valve 80 causes water vaporfrom the water vapor source 44 to be supplied through conduit 96 andwater vapor port 24 to the duct 82.

With the reversing valve 80 in the first operating position, hot gas andwater vapor rapidly flow from duct 82, under electronic component 26, toduct 84, thereby rapidly heating the solder connections 46 that attachthe electronic component 26 to the substrate 30. This flow directioncauses a solder connection 46′ on the end of the electrical component 26adjacent the duct 82 to heat faster than a solder connection 46″ locatedon the opposite side of the electrical component 26 (i.e., near duct84). This uneven heating occurs because the hot gas releases energy asit travels from duct 82, under the electrical component 26, into duct84. The release of energy is accompanied by a corresponding decrease inthe temperature of the gas.

In order to provide a rapid uniform heating of all of the solderconnections 46, thereby avoiding the uneven heating described above, thereversing valve 80 is switched to a second operating position. In thesecond operating position, the reversing valve 80 causes the vacuumsource 20 to generate a vacuum in duct 82 via conduit 94 and port 86,and simultaneously causes a stream of hot gas provided by the hot gassource 22 to be supplied through conduit 92 and port 88 to the duct 84.Thus, hot air passes in a second, opposite direction through duct 84,under the electronic component 26, and into duct 82. The hot air issubsequently drawn out of duct 82 through port 86 and conduit 94. Inaddition, the second operating position of the reversing valve 80 causeswater vapor from the water vapor source 44 to be supplied throughconduit 90 and water vapor port 25 to the duct 84. Thus, when thereversing valve 80 is in the second position, hot gas and water vaporrapidly flow from duct 84 to the vacuum in duct 82.

By periodically switching the reversing valve from the first to thesecond operating position, rapid, essentially uniform heating of thesolder connections 46 occurs. That is, hot air flows past each of thesolder connections 46 in two different directions, thereby providing asubstantially uniform heating of the solder connections 46. Thisminimizes the time that is required to heat all the solder connections46 to a required reflow temperature.

The operation of the reversing valve and the configuration of associatedconduits and ports may be expanded to periodically direct a flow of hotair under the electronic component 26 from more than two differentdirections. This would provide an even more uniform heating of thesolder connections 46. In addition, a heating medium other than a hotgas may be used. For example, a liquid heated to a sufficienttemperature could be directed under the electronic component 26 in asingle direction, or in multiple directions, to reflow the solderconnections 46.

FIGS. 7 and 8 illustrate a first embodiment of an underfill nozzleapparatus 100 in accordance with the present invention. Underfillmaterial 102 is deposited along three sides 104, 106, and 108, of theelectronic component 26. Solder connections 46 attach, and create aspace 122 between, the electronic component 26 and the surface of thesubstrate 30. The underfill nozzle apparatus 100 includes a vacuum tube110 and a vacuum source 112. A first end 114 of the vacuum tube 110contacts the surface of the substrate 30, and provides an essentiallygas tight seal. A second end 113 of the vacuum tube 110 is connected tothe vacuum source 112. A side 116 of the vacuum tube 110 is positionedin contact with a side 118 of the electronic component 26. A vacuum isdrawn through the opening 120 between the electrical component 26 andthe substrate 30 on side 118 of the electronic component 26. The vacuumrapidly draws the underfill material 102 previously deposited along thethree remaining sides 104, 106, and 108 of the electronic component 26into the space 122 under the electronic component 26, thereby coveringthe solder connections 46.

FIGS. 9 and 10 illustrates a second embodiment of an underfill nozzleapparatus 124 in accordance with the present invention. Solderconnections 46 attach, and create a space 160 between, the electroniccomponent 26 and the surface of the substrate 30. The underfill nozzleapparatus 124 includes a vacuum tube 126, a vacuum source 128, anunderfill material source 130, an underfill tube 132, baffles 134, 136,a heat generating apparatus 138, and a control system 140.

A first end 142 of the vacuum tube 126 contacts the surface of thesubstrate 30, and provides an essentially gas tight seal. A second end144 of the vacuum tube 126 is connected to the vacuum source 128. Afirst end 146 of the underfill tube 132 contacts the substrate surface30, and forms a seal against the surface of the substrate 30. A secondend 149 of the underfill tube is connected to the underfill materialsource 130. A side wall 148 of the vacuum tube 126 extends partiallytoward the substrate 30, thereby providing an opening 150 that allowsaccess to the area under the electronic component 26. Similarly, a sidewall 152 of the underfill tube 132 extends partially toward thesubstrate 30, and provides an opening 154 that allows access to the areaunder the electronic component 26.

The heat generating apparatus 138 supplies heat to the underfillmaterial 102 using heating coils 156 or other suitable means. The heatsupplied by the heating coils 156 reduces the viscosity of the underfillmaterial 102, thereby increasing the flow rate of the underfill material102 as the underfill material is drawn into the space 160 under theelectronic component 26. Heat 158 may also be supplied to the electroniccomponent 26 by the heat generating apparatus 138 to prevent theelectronic component 26 from acting as a heat sink and causing areduction in the temperature of the underfill material 102. Anyreduction in the temperature of the underfill material 102 would resultin an increase in viscosity and a decrease in the flow rate. The heat158 may be in the form of radiant heat, a stream of hot gas, a hotliquid, or the like.

Baffles 134, 136 join the vacuum tube 126 to the underfill tube 132. Thebaffles 134, 136 also form a seal against the surface of the substrate30 on opposing sides 164, 162 of the electronic component 26.

A control system 140 may be provided to control the operation of theunderfill material source 130 and the vacuum source 128. The controlsystem 140 may include a timer and a transducer 165. The transducer 165is utilized to sense when the region 160 under the electronic component26 has been filled to a predetermined level with the underfill material102. The transducer 165 may comprise, for example, a proximity sensor, alight beam switch, or the like.

The control system 140 is configured to activate the vacuum source 128,the underfill material source 130, and the heat generating apparatus 138to draw a supply of underfill material 102 beneath the electroniccomponent 26. The underfill material 102 rapidly flows from theunderfill tube 132, under the electronic component 26, toward the vacuumtube 126, due to the vacuum generated by the vacuum source 128, and theheat supplied by the heat generating apparatus 138. The control system140 deactivates the vacuum source 128, the underfill material source130, and the heat generating apparatus 138, upon receipt of a signalfrom the transducer 165 indicating that the space 160 under theelectronic component 26 has been filled to a predetermined level withunderfill material 102. Alternately, a timer may be used by the controlsystem 140 to activate/deactivate the various components of theunderfill rework apparatus 124.

FIGS. 11 and 12 illustrate another embodiment of an underfill nozzleapparatus 170 in accordance with the present invention. Underfillmaterial 102 is deposited along the periphery of the electroniccomponent 26. Solder connections 46 create a space 178 between theelectronic component 26 and the surface of the substrate 30. A vacuumsource 172 supplies a vacuum via a through hole 174 in the substrate 30.As a vacuum is produced by the vacuum source 172, the underfill material102 is rapidly drawn toward the through hole 174 from the periphery ofthe electronic component 26, thereby rapidly filling the space 178 underthe electronic component 26.

FIGS. 13 and 14 illustrate yet another embodiment of an underfill nozzleapparatus 180 in accordance with the present invention. The underfillnozzle apparatus 180 includes a vacuum tube 182 and an underfill tube186. A through hole 184 is located under the electronic component 26 andpasses through the substrate 30. Solder connections 46 create a space200 between the electronic component 26 and the surface of the substrate30.

A first end 190 of the vacuum tube 182 has a cross-sectional areaslightly larger than that of the electronic component 26. The first end190 of the vacuum tube 182 contacts the surface of the substrate 30 andprovides an essentially gas tight seal around the electronic component26. A second end 194 of the vacuum tube 182 is connected to a vacuumsource 192.

A first end 196 of the underfill tube 186 surrounds the through hole184. The second end 198 of the underfill tube 186 is connected to aunderfill material source 199. Underfill material 102 is injected viathe through hole 184 into the space 200 under the electronic component26. The vacuum applied in the vacuum tube 182 assists the flow ofunderfill material 102 into the space 200 under the electronic component26. Specifically, the underfill material 102 is drawn by the vacuum fromthe center toward the periphery of the space 200 under the electroniccomponent 26.

The foregoing description of the present invention has been presentedfor purposes of illustration and description. It is not intended to beexhaustive or to limit the invention to the precise form disclosed, andmany modifications and variations are possible in light of the aboveteaching. Such modifications and variations that may be apparent to aperson skilled in the art are intended to be included within the scopeof this invention as defined by the accompanying claims.

We claim:
 1. A method for inserting underfill material into a spacebetween an electronic component and a substrate, comprising: depositinga quantity of underfill material along all the sides of the electroniccomponent; providing a through hole in the substrate beneath theelectronic component; providing a vacuum source to produce a vacuumthrough a vacuum tube; positioning a first end of the vacuum tube overthe through hole on a surface of the substrate opposite from theelectronic component; forming an essentially gas tight seal between thefirst end of the vacuum tube and the surface of the substrate around thethrough hole; and applying the vacuum through the vacuum tube to thethrough hole to draw the underfill material from the sides of theelectronic component into the space between the electronic component andthe substrate.
 2. The method of claim 1, wherein the space into whichthe underfill material is drawn by the vacuum is formed by a pluralityof solder connections attaching the electronic component to thesubstrate.
 3. The method of claim 1, wherein the through hole is formedbeneath a central area of the space between the electronic component andthe substrate.
 4. The method of claim 3, wherein the vacuum draws theunderfill material from the sides of the electronic component toward thecentral area of the space between the electronic component and thesubstrate.
 5. A method for inserting underfill material into a spacebetween an electronic component and a substrate, comprising: enclosingthe electronic component within a housing, wherein the housing comprisesa vacuum tube; positioning a first end of the vacuum tube over theelectronic component; forming an essentially gas tight seal between thefirst end of the vacuum tube and a surface of the substrate around theelectronic component; providing a through hole in the substrate beneaththe electronic component; injecting underfill material via the throughhole into the space between the electronic component and the substrate;and applying a vacuum to the housing to draw underfill material into thespace between the electronic component and the substrate, wherein thevacuum to the housing is applied thru the vacuum tube.
 6. The methodaccording to claim 5, wherein the housing comprises a tube having afirst end in contact with the substrate, and a second end coupled to avacuum source for applying the vacuum.
 7. The method according to claim5, wherein an end of the vacuum tube is coupled to a vacuum source forapplying the vacuum.
 8. The method of claim 5, wherein the first end ofthe vacuum tube has a cross-section slightly larger than that of theelectronic component.
 9. The method of claim 5, further comprising:supplying the underfill material through an underfill tube.
 10. Themethod of claim 9, wherein a first end of the underfill tube surroundsthe through hole on a surface of the substrate opposite from theelectronic component.
 11. The method of claim 10, wherein a second endof the underfill tube is coupled to a source of the underfill material.12. The method of claim 5, wherein the through hole is formed beneath acentral area of the space between the electronic component and thesubstrate.
 13. The method of claim 12, wherein the vacuum draws theunderfill material from the central area of the space toward a peripheryof the space.